TY  - COMP
TI  - Hole Mobility of carbon (C): Data extracted from the Landolt-Börnstein book series and associated databases (https://materials.springer.com/interactive?systemId=9&propertyId=hole+mobility&database=semiconductor)
PB  - Springer-Verlag Berlin Heidelberg, Germany
UR  - https://materials.springer.com/interactive?systemId=9&propertyId=hole+mobility&database=semiconductor
N1  - Copyright 2017 Springer-Verlag Berlin Heidelberg, Germany
ID  - smat2017:smi_systemId_9_propertyId_hole+mobility_database_semiconductor
ER  -