Landolt-Börnstein - Group III Condensed Matter

2.2.1.6 Models of reconstruction

Abstract

This chapter discusses surface preparation methods for semiconductor and insulator surfaces. Clean metal surfaces are usually prepared by repeated cycles of ion bombardment and annealing (IBA). Semiconductor and insulator surfaces can be either prepared with the same procedure, or by cleaving in ultra-high vacuum (UHV). Laser annealing is also sometimes used. The cleanliness of the surface is monitored by various techniques, including Auger electron spectroscopy (AES), X-ray photoelectron spectroscopy (XPS), and HREELS.

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Title
2.2.1.6 Models of reconstruction
Book Title
Structure
In
2.2.1 Introduction
Book DOI
10.1007/b41604
Chapter DOI
10.1007/10031427_28
Part of
Landolt-Börnstein - Group III Condensed Matter
Volume
24A
Editors
  • G. Chiarotti
  • Authors
  • A. Fasolino
  • A. Selloni
  • A. Shkrebtii
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